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 【Date:2016-10-8】 【Source:】 【Clicks:727】 【FONT:12 14 16 】【Print article
    Hanking Electronics focuses on MEMS design, fabrication and marketing of MEMS products and related electronics components. Hanking has an 8 inches MEMS fab located in Fushun, China. Its process capabilities covers those needed for MEMS pressure sensors, accelerometers, gyros, flow sensors and are available for foundry customers. Hanking has a R&D center in Cleveland Ohio and design teams in Milan and Pisa, Italy.

     

 Major equipment:

Equipment

Manufacturer

VERTICAL FURNACE

TOKYO ELECTRON

SPUTTER DEP

APPLIED MATERIALS

 DRYER

APET

DRIE

SPTS

ETCHER

LAM RESEARCH

Evaporator

EVATEC

EV GROUP BONDER

EV GROUP

LIFT OFF

SOLID STATE EQUIP CORP

SPRAY COAT/BAKE

SUSS MICROTEC

GRINDER

DISCO

MVD

APPLIED MICROSTRUCTURES

TEST EQUIPMENT

ELECTROGLAS

SPEA TESTER

SPEA AMERICA

STEPPER

ASML INCORPORATED

NOVELLUS C2 ALTUS

NOVELLUS

 

 Main process:

1

Film deposition     

Hi-K dielectric deposition     

Polysilicon deposition     

PECVD Oxide deposition     

Low Temperature Oxide deposition     

Germanium CVD     

Antistiction film coating deposition  

2

Metal deposition     

Gold plating     

Multilayer metal film deposition     

Germanium sputtering     

Seed layer deposition     

3

Thermal     

Thermal Oxidation     

Hi-K dielectric annealing     

Oxide layer annealing     

4

Wet     

RCA clean     

BOE     

Wet etch silicon   ,   

Post DRIE wet clean     

Wet remove photoresist     

Pre-furnace clean     

5

Wafer bonding     

Aluminum Germanium Eutectic bonding  

Gold-Silicon Eutectic bonding  

Fusion

Anodic

6

Etch     

High aspect ratio etch DRIE     

Vapor phase oxide etch     

Rapid Silicon etch     

Metal etch     

Backside etch     

Polysilicon etch     

Hi-K dielectric etch     

Oxide etch  

7

Lithography     

Photoresist coating     

Photoresist spray     

Full field aligner exposure     

DRIE 5x stepper exposure  

Lift off